2023 the 3rd International Conference on Smart Manufacturing, Industrial & Logistics Engineering (SMILE2023) will be sponsored by Sichuan University, Taiwan Tsing Hua University and Tianjin University, and organized by Business School, Sichuan University in Chengdu, China during November 17-19, 2023. It aims to provide a high-level international forum for experts, scholars and entrepreneurs to foster the exchange of research developments and latest practice on smart manufacturing, industrial engineering and logistics.(click here to submit)


Key Dates

Special Session Submission Deadline

Abstract/Paper Submission Deadline

Notification of Paper Acceptance

Final Paper Submission Deadline

Opening Ceremony

on or before September 15, 2023

on or before September 30, 2023

extending to October 20, 2023

on or before October 15, 2023

on or before October 31, 2023

on November 18, 2023


Proceedings of full papers will be published by Springer in book series of Lecture Notes in Mechanical Engineering and delivered for EI indexing. Extended version of selected papers will be recommended for possible publications in special issues of SCI journals.

Conference Registration Fee


1. Full registration (both regular and student) fee includes, banquet, lunches and coffee breaks and attendance to all the conference sessions

2. Each paper must have at least one registration. Registrations without appropriate payment will not be honored until the full payment is received. A confirmation of registration will be sent upon full payment.

Conference Registration

For participants overseas: The registration form can be downloaded by clicking here.,and send the filled-out registration form to the email:

For participants from Chinese Mainland: Please scan the QR code to get registered on line. Or you could download the registration form by clicking here.,and send the filled-out registration form to the email:

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