2023 the 3rd International Conference on Smart Manufacturing, Industrial & Logistics Engineering (SMILE2023) will be sponsored by Sichuan University, Taiwan Tsing Hua University and Tianjin University, and organized by Business School, Sichuan University in Chengdu, China during November 17-19, 2023. It aims to provide a high-level international forum for experts, scholars and entrepreneurs to foster the exchange of research developments and latest practice on smart manufacturing, industrial engineering and logistics.(click here to submit)

2023年第三届智能制造与工业物流工程国际会议（SMILE2023）由台湾清华大学、天津大学、四川大学联合主办，四川大学商学院承办。会议将于2023年11月17-19日在中国成都四川大学商学院举行！本次会议旨在为全球范围内智能制造和工业物流工程领域的专家、学者和企业界人士提供理论研究、成果展示和实践探索的交流平台，以期推动智能制造与工业物流工程在高校和企业中的发展及应用。欢迎智能制造和工业物流工程领域的专家、学者和企业界人士踊跃报名参会！(点击投稿)

Proceedings of full papers will be published by Springer in book series of Lecture Notes in Mechanical Engineering and delivered for EI indexing. Extended version of selected papers will be recommended for possible publications in special issues of SCI journals.

Notes:

1. Full registration (both regular and student) fee includes, banquet, lunches and coffee breaks and attendance to all the conference sessions

2. Each paper must have at least one registration. Registrations without appropriate payment will not be honored until the full payment is received. A confirmation of registration will be sent upon full payment.

For participants overseas: The registration form can be downloaded by clicking here.,and send the filled-out registration form to the email:
liushimei@tju.edu.cn

For participants from Chinese Mainland: Please scan the QR code to get registered on line. Or you could download the registration form by clicking here.,and send the filled-out registration form to the email:
liushimei@tju.edu.cn